三建技術課程
2024/10/18(五),09:00-10:30
線上視訊
【中文譯本】
隨著業界對CPO共封裝光學的重視程度日益增加，並將其視為戰略方向，深入了解矽光子學的複雜性變得至關重要，因為其能力和功能對於CPO共封裝光學可以為更廣泛的 CMOS 生態系統帶來的優勢產生重大影響。
本課程將概述能夠實現CPO共封裝光學的工具、技術和方法，全面探索矽 (Si) 光子學在推動和支持當前產業中正在進行的CPO共封裝光學的巨大潛力，更將特別討論光學收發器、光子/電子元件的共同設計以及光模組封裝挑戰等方面的性能預期。
【英文原稿】
As the industry places increasing emphasis on co-packaged optics as a strategic direction, understanding the intricacies of Si photonics becomes pivotal, as its capabilities and functionalities wield a significant influence over the advantages that co-packaged optics can bring to the broader CMOS ecosystem. As such the tools, technologies and approaches which enable co-packaged optics will be overviewed in this course. A thorough exploration of the remarkable potential of Silicon (Si) photonics in driving and supporting the ongoing co-packaged optics initiatives within the current industry landscape. In particular, the performance expectations on fronts including optical transceivers, co-design of photonics / electronics components, as well as optical module packaging challenges will be discussed.
Amr Helmy
■學歷：
博士／格拉斯哥大學
■經歷：
多倫多大學電機系教授
Agilent Technologies 資深工程師
■報名費包含1本黑白紙本講義
■選購 - 彩色紙本講義525元/本
| 報名1位 | |
|---|---|
| 原價 (+) | 1,525 |
| 自費 (=) | 1,525 |
※主辦單位得因不可抗拒因素，保留內容及講師異動之權利。
※恕不提供課程電子檔。